The efficient method for best results

Icon Wide range of application

Wide range of application

Low-pressure plasma is produced by electromagnetic fields. The induced chemical reactions and physical effects depend on the respective gas and excitation frequency used for plasma formation.

The used gas, for instance, determines if the respective plasma is an oxidizing or reducing medium or neither of them (neutral).

Icon Neutral plasmas

Neutral plasmas

Neutral plasma forms e.g. if a noble gas like argon is used. The major effect of neutral plasma is physical: Contaminants are removed by a bombardment with heavy ions (sputtering). Low excitation frequencies (kHz range) will boost this effect significantly as ions will gain much more velocity before they impact onto the surface. As fast and heavy ions transfer heat to the surfaces they collide with, this method is limited to suitable materials and surfaces.

Icon Reactive plasmas

Reactive plasmas

Reactive plasmas are formed from gases like oxygen, hydrogen or fluorocarbons. The oxidizing, reducing or functionalizing effects originate from the ions and radicals present in plasma which readily react with the substrate material or the topping contaminant. After plasma treatment, surfaces are activated, passivated or particularly clean, respectively.

An especially high excitation frequency (GHz) promotes such reactions as it results in a high ion density in the plasma phase and therefore maximizes reactivity. Simultaneously, ion energies remain low, so sputter effects and heat load are minimized or not incurred at all.

Icon Eco-friendly and efficient

Eco-friendly and efficient

Such procedures of the low-pressure plasma technology are not only extremely efficient, but also ecologically neutral and economically useful because usually no polluting waste products and no disposal costs incur therefore.

Exemplary low-pressure plasma treatment effects

  • Removal of organic residues
  • Activation by means of oxidation of polymer chains
  • Coating by means of polymerisation of suitable monomers
  • Removal of disturbing oxide layers by reduction
  • Etching by the use of aggressive gases and reaction conditions

Varying process gases and excitation frequencies, there is a broad selection of possible plasma effects. Verification of the desired plasma effect on the actual substrate should never be skipped as thorough process development may be necessary. PINK warrants its developed processes and therefore safeguards customer’s investments in PINK equipment.

Compare systems


V6-G V10-G V15-G V55-G V80-G-Side
Type of system Tabletop unit Tabletop unit 19" cabinet 19" cabinet 19" cabinet
Dimensions of the chamber
(W x D x H)
170 x 200 x 170 Ø215 x 260 250 x 250 x 250 400 x 460 x 340 400 x 500 x 430
Microwave power
50-300 50-600 100-600 100-1,200 100-1,200
Gas inlets with mass flow control 1 1 1 2 2
Power supply 230 V, 50/60 Hz 230 V, 50/60 Hz 230 V, 50/60 Hz 230 V, 50/60 Hz 230 V, 50/60 Hz
Power input (without pump)
0.5 1.5 1.5 2.2 2.2
Dimensions of the system
(W x D x H)
640 x 710 x 710 720 x 820 x 820 670 x 900 x 1,850 670 x 900 x 1,850 850 x 900 x 1,850


Additional gas inlets 2 2 3 2 2
Additional excitation frequencies
(40 kHz, 13.56 MHz)
- - yes yes Yes
Soft start/slow vent Yes Yes Yes Yes Yes
Lateral microwave feed-in Yes - Yes - Yes
Rotary table - - Yes Yes Yes
Rotary drum Yes - Yes Yes Yes
Pullout door - Yes - Yes Yes
Automatic door opening - - - Yes Yes