Vacuum soldering system VADU 200XL-W
Soldering of substrates and wafers in series production
The soldering system of type VADU 200XL-W is equipped with two separate process chambers and can be operated with paste as well as preforms.
The VADU 200XL-W enables the soldering of wafers up to 12 inch. Customized carriers are also offered by PINK.
This system allows the precise control of all relevant process parameters e.g. the temperature gradients during heating and cooling. Due to its intelligent temperature management the system provides short cycle times and an excellent temperature stability.
Vacuum soldering system VADU 200XL-W
| Type of system | Batch system |
| Number of vacuum chambers | 2 chambers |
| Process area (W x D) | 410 x 320 mm |
| Clearance height | max. 100 mm |
| Vacuum (standard) | ≤ 2 mbar |
| Dimensions of the system (W x D x H) | 1,200 x 1,890 x 1,680 mm |
| Dimensions of pumping unit | Integrated |
| Weight | 1,200 kg |
| Power supply | 3 x 400 V, 50/60 Hz |
| Power input | 10 kVA |
| SMEMA interface | – |
| Carriers | Wafer up to 12" |
Options
| Handling / transfer systems |  |
| Integrated MES interfaces (e.g. SECS/GEM) | |
System features
- Void-free solder connections
- Soldering with preforms and/or pastes
- Individual soldering profiles
- Process temperatures up to 400 °C
- Controlled temperature gradients
- Short cycle times
- Separate soldering and cooling chamber
- Flux-free soldering with formic acid
- Flux management
- Inert gas atmosphere
- Residual oxygen content < 5 ppm
- Reproducibility of the soldering results
- Traceability
- Permanent process control
- Ethernet interface
- Remote maintenance (VPN)
- Low energy and media consumption
Compare systems
|
Type |
VADU 100 | VADU 200XL | VADU 300XL | VADU 400XL |
| Type of system | Batch system | Batch or Inline system | Inline system | Inline system |
| Number of vacuum chambers | 1 chamber with 2 separate process zones |
2 chambers | 3 chambers | 4 chambers |
| Process area (W x D) [mm] |
168 x 280 | 410 x 280 | 410 x 280 | 410 x 280 |
| Clearance height [mm] |
max. 50 | max. 100 | max. 100 | max. 100 |
| Vacuum (standard) [mbar] |
≤ 2 | ≤ 2 | ≤ 2 | ≤ 2 |
| Dimensions of the system (W x D x H) [mm] |
1,070 x 1,130 x 1,150 | 1,758 x 1,911 x 2,381 | 2,436 x 1,911 x 2,381 | 3,114 x 1,911 x 2,381 |
| Dimensions of pumping unit [mm] |
Integrated | 1,027 x 762 x 1,376 | 1,027 x 762 x 1,996 | 1,027 x 1,452 x 1,376 |
| Weight [kg] |
500 | 1,500 (without pumping unit) |
2,000 (without pumping unit) |
2,600 (without pumping unit) |
| Power supply | 3 x 400 V, 50/60 Hz | 3 x 400 V, 50/60 Hz | 3 x 400 V, 50/60 Hz | 3 x 400 V, 50/60 Hz |
| Power input [kVA] |
5 | 19 | 27 | 35 |
| SMEMA interface | – | |
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Options |
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| Handling / transfer systems |
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| Soldering temperatures up to 500 °C | |
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| Induction heating | |
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| Integrated MES interfaces (e.g. SECS/GEM) | |
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