System benefits
•Void free solder connections
•Soldering with preforms or paste
•Operation with formic acid
•Efficient flux management
•Process temperatures up to 400 °C
•Individual temperature profiles (e.g. in
accordance to IPC/JEDEC)
•Separate process chambers
•Low energy and media consumption
•Clearly arranged touch screen panel
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Technical data
| Size: approx. W 2,300 x D 1,600 x H 1,800 mm |
| Power supply: 3 x 400 V, 50/60 Hz + N + PE |
| Power input: 25 kVA |
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