System advantages
•Void-free solder connections
•Soldering with preforms or paste
•Operation with inert or forming gas
•Formic acid process
•Flux management
•Soldering temperatures up to 400 °C
•Vacuum supported soldering
•Individual soldering profiles
(e.g. acc. to IPC / JEDEC)
•Low energy and media consumption
•Clearly arranged touch screen panel
•Maintenance friendly process technology
Options
•Process variability in the first chamber
•Camera system for process monitoring
•Load and unload modules
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Technical data
| Process area: L 410 x B 280 mm (e.g. 4 boards 5 x 7 ") |
| Substrate height: max. 100 mm |
| Dimensions: approx. L 2,100 x W 1,200 x H 1,700 mm |
| Power supply: 3 x 400 V, 50/60 Hz |
| Power input: 12 kVA |
| Weight: approx. 1,000 kg |
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