System benefits
•Void free solder connections
•Temperature profiles in accordance with IPC/JEDEC
•Soldering with preforms or paste
•Soldering temperature up to 400 °C
•Separate process zones for soldering and cooling
•Vacuum supported soldering
•Operation with formic acid for forming gas
•Efficient flux management
•Clearly arranged touch screen panel
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Technical data
| Size: approx. W 1,100 x D 1,400 x H 1,200 mm |
| Power supply: 3 x 400 V, 50/60 Hz |
| Power input: 3 kW |
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