The formation of volatile gaseous products is decisive for the cleaning and etching effect in plasma. The components of the plasma react with the organic impurities
by reducing them to water and carbon dioxide even at room temperature:
(-CH2-CH2-)n+3nO2 —> 2nCO2+2nH2O
Even treatment times of just a few minutes produce excellent results and leave no residues on the surfaces. A major advantage is that low-pressure plasma can readily
penetrate cracks. Even intricately shaped parts can be easily cleaned or etched in plasma.
The method is also environmentally compatible as it does not generate any harmful products. This eliminates any additional disposal costs. |
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Areas of application include:
•Smart card industry
•Electrical industry
•Glass industry
•Optical industry
•Metal industry
•Microelectronics
•Jewelry and watch industry
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