Press releases 2007
 
Void Free Soldering with Vacuum -
From laboratory level to mass production
Shrinking package sizes of electronic devices require a perfect thermal management thus, void free soldering. Voids reduce the electrical and thermal conductivity and cause hot spots. In addition, lead free solder escalates the formation of voids...

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(111 KB)

PINK expanding and extending into plasma technology business
Effective as of June 12, 2007, Plasma-finish GmbH, Schwedt/Oder, has been taken over by PINK GmbH Thermosysteme, Wertheim, and as from now will operate as PINK GmbH Plasma-finish. For more than a decade, Plasma-finish has been developing and producing in the market for low-pressure plasma high-quality plant and systems...
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(125 KB)