Wafer

Vacuum soldering system VADU 200XL-W

Soldering of substrates and wafers in series production

The soldering system of type VADU 200XL-W is equipped with two separate process chambers and can be operated with paste as well as preforms.

The VADU 200XL-W enables the soldering of wafers up to 12 inch. Customized carriers are also offered by PINK.

This system allows the precise control of all relevant process parameters e.g. the temperature gradients during heating and cooling. Due to its intelligent temperature management the system provides short cycle times and an excellent temperature stability.

VADU200XL W

Type of system Batch system
Number of vacuum chambers 2 chambers
Process area (W x D) 410 x 320 mm
Clearance height max. 100 mm
Vacuum (standard) ≤ 2 mbar
Dimensions of the system (W x D x H) 1,200 x 1,890 x 1,680 mm
Dimensions of pumping unit Integrated
Weight 1,200 kg
Power supply 3 x 400 V, 50/60 Hz
Power input 10 kVA
SMEMA interface
Carriers Wafer up to 12"
Options:  
Handling/Transfer systems
Integrated MES interfaces (e.g. SECS/GEM)


System features

  • Void-free solder connections
  • Soldering with preforms and/or pastes
  • Individual soldering profiles
  • Process temperatures
    up to 400 °C
  • Controlled temperature gradients
  • Short cycle times
  • Separate soldering and cooling chamber
  • Flux-free soldering with formic acid
  • Flux management
  • Inert gas atmosphere
  • Residual oxygen content < 5 ppm
  • Reproducibility of the soldering results
  • Traceability
  • Permanent process control
  • Ethernet interface
  • Remote maintenance (VPN)
  • Low energy and media consumption
  • Internationally patented system