Wafer

Soldering system VADU 200XL-W

Vacuum supported soldering of wafers up to 12"

The soldering system of type VADU 200XL-W is equipped with two separate process chambers and can be operated with paste as well as preforms.

The VADU 200XL -W enables the soldering of wafers up to 12". Therefor PINK produces also customized carriers.

This system allow the precise control of all relevant process parameters
e.g. the temperature gradients during heating and cooling. Due to its intelligent temperature management the system provides short cycle times and an
excellent temperature stability.

VADU200XL W

Type of system Batch system
Number of vacuum chambers 2 chambers
Process area (W x D) 410 x 320 mm
Clearance height max. 100 mm
Vacuum (standard) ≤ 2 mbar
Dimensions of the system (W x D x H) 1,200 x 1,890 x 1,680 mm
Dimensions of pumping unit Integrated
Weight 1,200 kg
Power supply 3 x 400 V, 50/60 Hz
Power input 10 kVA
SMEMA interface
Carriers Wafer up to 12"
Options:  
Process temp. up to 500 °C
Induction heating
Handling/Transfer systems
High vacuum
MES interfaces (e.g. SECS/GEM)


System features

  • Void-free solder connections
  • Soldering with preforms and / or pastes
  • Individual soldering profiles
  • Process temperatures
    up to 400 °C
  • Controlled temperature gradients
  • Short cycle times
  • Separate soldering and cooling chamber
  • Formic acid process
  • Flux management
  • Inert gas atmosphere
  • Residual oxygen content < 5 ppm
  • Reproducibility of the soldering results
  • Traceability
  • Permanent process control
  • Ethernet interface
  • Remote maintenance (VPN)
  • Low energy and media consumption
  • Internationally patented system