Vacuum soldering system VADU 200XL-W

Soldering of substrates and wafers in series production

The soldering system of type VADU 200XL-W is equipped with two separate process chambers and can be operated with paste as well as preforms.

The VADU 200XL-W enables the soldering of wafers up to 12 inch. Customized carriers are also offered by PINK.

This system allows the precise control of all relevant process parameters e.g. the temperature gradients during heating and cooling. Due to its intelligent temperature management the system provides short cycle times and an excellent temperature stability.

Vacuum soldering system VADU 200XL-W

Vacuum soldering system VADU 200XL-W
Icon data sheet
Type of system Batch system
Number of vacuum chambers 2 chambers
Process area (W x D) 410 x 320 mm
Clearance height max. 100 mm
Vacuum (standard) ≤ 2 mbar
Dimensions of the system (W x D x H) 1,200 x 1,890 x 1,680 mm
Dimensions of pumping unit Integrated
Weight 1,200 kg
Power supply 3 x 400 V, 50/60 Hz
Power input 10 kVA
SMEMA interface
Carriers Wafer up to 12"
Icon options

Options

Handling / transfer systems YES
Integrated MES interfaces (e.g. SECS/GEM) YES
Icon features

System features

  • Void-free solder connections
  • Soldering with preforms and/or pastes
  • Individual soldering profiles
  • Process temperatures up to 400 °C
  • Controlled temperature gradients
  • Short cycle times
  • Separate soldering and cooling chamber
  • Flux-free soldering with formic acid
  • Flux management
  • Inert gas atmosphere
  • Residual oxygen content < 5 ppm
  • Reproducibility of the soldering results
  • Traceability
  • Permanent process control
  • Ethernet interface
  • Remote maintenance (VPN)
  • Low energy and media consumption

Compare systems

Type

VADU 100 VADU 200XL VADU 300XL VADU 400XL
Type of system Batch system Batch system Inline system Inline system
Number of vacuum chambers 1 chamber
with 2 separate process zones
2 chambers 3 chambers 4 chambers
Process area (W x D)
[mm]
168 x 280 410 x 280 410 x 280 410 x 280
Clearance height
[mm]
max. 50 max. 100 max. 100 max. 100
Vacuum (standard)
[mbar]
≤ 2 ≤ 2 ≤ 2 ≤ 2
Dimensions of the system
(W x D x H)
[mm]
1,070 x 1,130 x 1,150 1,200 x 1,890 x 1,680 2,410 x 1,610 x 1,800 3,020 x 1,660 x 1,800
Dimensions of pumping unit
[mm]
Integrated Integrated 990 x 690 x 1,800 990 x 1,290 x 1,800
Weight
[kg]
500 1,200 2,000
(without pumping unit)
2,600
(without pumping unit)
Power supply 3 x 400 V, 50/60 Hz 3 x 400 V, 50/60 Hz 3 x 400 V, 50/60 Hz 3 x 400 V, 50/60 Hz
Power input
[kVA]
5 10 25 35
SMEMA interface yes yes

Options

       
Handling /
transfer systems
yes yes yes yes
Soldering temperatures up to 500 °C yes yes yes yes
Induction heating yes yes yes yes
Integrated MES interfaces (e.g. SECS/GEM) yes yes yes yes

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