Low-pressure plasma system V10-G
Efficient batch system for removal of photoresist
The batch system V10-G is designed for the removal of photoresists. Furthermore it can be optimally used for the cleaning of wafers.
Areas of application
- Ideal system for removing photoresist layers (also SU-8) after dry processes like RIE or Ion Beam etching as well as after high dose implant processes
- Silicon wafers or other substrate cleaning prior wet processing to achieve a better wettability for an uniform and efficient result
- Applicable for processes in MEMS and nano technology
- Polymer removal e.g. after Bosch processes
- Removal of organic sacrificial layers
- Conditioning of bioactive compounds
| Type of system |
Tabletop unit |
| Dimensions of the chamber (Ø x D) |
215 x 260 mm |
| Mikrowave power |
50-600 W |
| Gas inlets with mass flow controller |
1 channel |
| Power supply |
230 V, 50/60 Hz |
| Power input (without pump) |
1.5 kVA |
| Vacuum gauge |
Pirani |
| Dimensions of the system (W x D x H) |
720 x 820 x 820 mm |
| Options:
|
|
| Vacuum pump |
√ |
| Ozone trap |
√ |
| Additional gas inlets |
up to 2 |
| Soft start and slow vent |
√ |
| Faraday cage |
√ |
| Process pressure control valve |
√ |
