Plasmatechnik - Chipkarten

Cleaning with low-pressure plasma

Ultrapure surface cleaning

Clean and reliable method

Surface cleaning in industry plays an important role for improving coating adhesion.

Conventional cleaning methods have their specific and, following wet-chemical cleaning, traces of detergent or solvent are not completely removed even after thorough rinsing and drying.

However, low-pressure plasma cleaning results in surfaces free of organic contamination. Treatment cycles of just a few minutes give outstanding results with no surface residues..

The excellent crack penetration of low-pressure plasma is advantageous. This means that even intricately formed parts are perfectly cleaned since the gas also penetrates into small gaps that liquids cannot reach.

The decisive factor in the plasma cleaning process is the formation of gaseous and hence volatile products that can be removed from the sample chamber without any problems. The plasma components react with the organic
contamination and degrade it to water and carbon dioxide at room temperature:
(-CH2-CH2-)n + 3n O2 " 2n CO2 + 2n H2O

Areas of application

  • Optical industry
  • Microelectronics
  • Chip card production
  • Electrical engineering
  • Glassware industry
  • Metalworking industry
  • Watch industry

Advantages of plasma cleaning

  • Extremely clean surfaces (ultrapure cleaning)
  • Low treatment temperature
  • High crack penetration
  • No downstream drying necessary
  • No detergent residues
  • KNo waste disposal costs
  • Low operating costs
  • Eco-friendly process

Production integration options

Intelligent automation engineering allows plasma systems to be integrated into production lines..

Selecting suitable pump systems allows evacuation times to be reduced to such a degree that cycle frequencies can be matched to application requirements. In addition, modularly designed systems allow a quick and flexible respond to production expansions.

Which materials are not really suitable
for low-pressure plasma cleaning?

All materials causing a signifi cant disturbance of the vacuum and / or plasma because of emission. This applies to some silicones and fabrics.

Plasma processes are hardly suitable for inorganic contaminations. However, workpieces with both inorganic and organic contaminations can be cleaned in combination with wet-chemical pre-cleaning.

Suitable materials for low-pressure plasma cleaning

All vacuum-proof and plasma-resistant materials like e.g. most of the plastics, metals, glasses, ceramics, caoutchouc / rubber, even foam materials.

Cleaning in low-pressure plasma significantly improves the bondability of this leadframe.